LIGHT EMITTING DIODE PACKAGES AND THEIR USES

LIGHT EMITTING DIODE PACKAGES AND THEIR USES AbstractThe present invention describes LED packages in the form of a button (100, 100a, 100b, 100c, 100d, 100e), ring (200, 200a, 200b, 200c, 200d), quad-wing (300) or surface mount (400) configurations. These LED packages (100, 200, 300, 400, etc) have...

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Bibliographische Detailangaben
1. Verfasser:	SEOW THIAM HIN KENNIE
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS BLASTING CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO USESOR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS LABELS OR NAME-PLATES LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	LIGHT EMITTING DIODE PACKAGES AND THEIR USES AbstractThe present invention describes LED packages in the form of a button (100, 100a, 100b, 100c, 100d, 100e), ring (200, 200a, 200b, 200c, 200d), quad-wing (300) or surface mount (400) configurations. These LED packages (100, 200, 300, 400, etc) have contact elements (121, 125, 221, 225, etc) that define two substantially parallel spaced apart planes. In use, these LED packages (100, 200, etc) are disposed between two spaced apart panels (510, 510a, etc). Each inside surface of the panels assembly has a conductive layer (520), each being in electrical contact with an associated contact element (121,125, 221, 225, etc) of each I FD package (100, 200, etc). A DC power supply is operable to deliver power to the I FD package (100, 200, etc) through the conductive layers (520).FIG. 6A for publication.