SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES DURING WIRE AND RIBBON BONDING OPERATIONS
OEC-129W0 PATENT21 -Abstract A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | OEC-129W0 PATENT21 -Abstract A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation. |
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