STACKED DIE IN DIE BGA PACKAGE

STACKED DIE IN DIE BGA PACKAGE

A stacked die assembly is disclosed which eliminates the need for the spacer between stacked dies that allowing clearance for the bonding leads/wires to the substrate. A first die 42 is positioned on a substrate 44 with a second die 46 positioned on top. The underside perimeter of the second die is...

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Hauptverfasser: TAN, VICTOR CHER KHNG, TAN, MICHAEL KIAN SHING, NEO, CHEE PENG, TAN, HOCK CHUAN, CHEW, BENG CHYE, LIM, THIAM CHYE
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TAN, VICTOR CHER KHNG
TAN, MICHAEL KIAN SHING
NEO, CHEE PENG
TAN, HOCK CHUAN
CHEW, BENG CHYE
LIM, THIAM CHYE
description A stacked die assembly is disclosed which eliminates the need for the spacer between stacked dies that allowing clearance for the bonding leads/wires to the substrate. A first die 42 is positioned on a substrate 44 with a second die 46 positioned on top. The underside perimeter of the second die is recessed 63 to allow a clearance for the bonding wires 50a. Figure No. 4
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title STACKED DIE IN DIE BGA PACKAGE
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