STACKED DIE IN DIE BGA PACKAGE

A stacked die assembly is disclosed which eliminates the need for the spacer between stacked dies that allowing clearance for the bonding leads/wires to the substrate. A first die 42 is positioned on a substrate 44 with a second die 46 positioned on top. The underside perimeter of the second die is...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAN, VICTOR CHER KHNG, TAN, MICHAEL KIAN SHING, NEO, CHEE PENG, TAN, HOCK CHUAN, CHEW, BENG CHYE, LIM, THIAM CHYE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A stacked die assembly is disclosed which eliminates the need for the spacer between stacked dies that allowing clearance for the bonding leads/wires to the substrate. A first die 42 is positioned on a substrate 44 with a second die 46 positioned on top. The underside perimeter of the second die is recessed 63 to allow a clearance for the bonding wires 50a. Figure No. 4