SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

On top of respective areas divided by partition plates (10,60), that is, a cassette station (2), a processing station (3), and an interface section (4) in a coating and developing processing system (1), gas supply sections (70- 72) for supplying an inert gas into the respective areas are provided. E...

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Bibliographische Detailangaben
Hauptverfasser: IIDA NARUAKI, AOYAMA TORU, MATSUYAMA YUJI, YAMASHITA MASAMI, SHIMURA SATORU, DEGUCHI MASATOSHI, KATANO TAKAYUKI, MATSUI HIDEFUMI, YOSHIHARA KOUSUKE, KITANO JUNICHI, IWAKI HIROYUKI, KITANO TAKAHIRO, SUZUKI YO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:On top of respective areas divided by partition plates (10,60), that is, a cassette station (2), a processing station (3), and an interface section (4) in a coating and developing processing system (1), gas supply sections (70- 72) for supplying an inert gas into the respective areas are provided. Exhaust pipes (75-78) for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections (70-72) into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes (75-78).