ELECTROPOLISHING AND/OR ELECTROPLATING APPARATUS AND METHODS
An apparatus for electropolishing and/or electroplating a conductive film on a wafer includes various processing modules such as cleaning modules, processing modules, alignment modules as well as various apparatus for carrying out the processes of the difference modules such as robotics, end effecto...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!