ELECTROPOLISHING AND/OR ELECTROPLATING APPARATUS AND METHODS

An apparatus for electropolishing and/or electroplating a conductive film on a wafer includes various processing modules such as cleaning modules, processing modules, alignment modules as well as various apparatus for carrying out the processes of the difference modules such as robotics, end effecto...

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Bibliographische Detailangaben
Hauptverfasser: VAN KERKWYK, MARK, JACOBUS, KOEHLER, DAMON, L, NGUYEN, MY, HOANG, GUTMAN, FELIX, AFNAN, MUHAMMED, YIH, PEIHAUR, HO, FREDERICK, WANG, HUI, NUCH, VOHA, CHOKSHI, HIMANSHU, J, CHANG, RU, KAO
Format: Patent
Sprache:eng
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