ELECTROPOLISHING AND/OR ELECTROPLATING APPARATUS AND METHODS

An apparatus for electropolishing and/or electroplating a conductive film on a wafer includes various processing modules such as cleaning modules, processing modules, alignment modules as well as various apparatus for carrying out the processes of the difference modules such as robotics, end effecto...

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Bibliographische Detailangaben
Hauptverfasser:	VAN KERKWYK, MARK, JACOBUS, KOEHLER, DAMON, L, NGUYEN, MY, HOANG, GUTMAN, FELIX, AFNAN, MUHAMMED, YIH, PEIHAUR, HO, FREDERICK, WANG, HUI, NUCH, VOHA, CHOKSHI, HIMANSHU, J, CHANG, RU, KAO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus for electropolishing and/or electroplating a conductive film on a wafer includes various processing modules such as cleaning modules, processing modules, alignment modules as well as various apparatus for carrying out the processes of the difference modules such as robotics, end effectors, liquid delivery systems, and the like. In this the apparatus for transferring wafers from one processing module to another for processing comprises an end effector including an aperture to create vacuum in a vacuum cup seal to securely hold and transfer semiconductor wafer. The end effector further includes a cap having a groove formed therein for improving suction and vacuum of end effector 'thereby reducing the potential of blocking of the aperture.