PROCESS FOR INHIBITING CORROSION AND REMOVING CONTAMINANT FROM A SURFACE DURING WAFER DICING AND COMPOSITION USEFUL THEREOF

PROCESS FOR INHIBITING CORROSION AND REMOVING CONTAMINANT FROM A SURFACE DURING WAFER DICING AND COMPOSITION USEFUL THEREOF

Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or s...

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Hauptverfasser: LHOTA CHARLES A, COLLIER TERENCE QUENTIN, RAO MADHUKAR BHASKARA, RENNIE DAVID BARRY, TAMBOLI DNYANESH CHANDRAKANT, RAMAMURTHI RAJKUMAR
Format: Patent
Sprache:eng
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Zusammenfassung:Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.