SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly proces...

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Hauptverfasser: NG CATHERINE BEE LIANG, SUN ANTHONY YI SHENG, TOH CHIN HOCK
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Sprache:eng
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creator NG CATHERINE BEE LIANG
SUN ANTHONY YI SHENG
TOH CHIN HOCK
description The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly processes.
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