SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly proces...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NG CATHERINE BEE LIANG, SUN ANTHONY YI SHENG, TOH CHIN HOCK
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly processes.