APPARATUS AND METHOD FOR ARRANGING DEVICES FOR PROCESSING

An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and...

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Bibliographische Detailangaben
Hauptverfasser:	TANG HOI SHUEN, JOSEPH, WAH CHENG CHI, LOK CHAN SEE, MAK TIM WAI, TONY
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.