SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temp...

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Bibliographische Detailangaben
Hauptverfasser: TAN BRYAN SOON HUA, CHOW SOO PIN, MANALAC RODEL, HETZEL WOLFGANG JOHANNES, ENG KIAN TENG, AMMER FLORIAN, ONG PANG HUP, CASTILLO DENVER PAUL C, REISS WERNER JOSEF
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200oC and the pressure is applied for a range of approximately 1 to 10 seconds.