SUBSTRATES AND METHODS OF USING THOSE SUBSTRATES

SUBSTRATES AND METHODS OF USING THOSE SUBSTRATES

Substrates and Methods of Using Those Substrates A method of removing contamination from an apparatus used in lithography is disclosed. The method includes loading a substrate into the apparatus, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support laye...

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Bibliographische Detailangaben
Hauptverfasser: VAN DER DONCK, JACQUES, COR, JOHAN, VAN DER GRAAF, SANDRA, JANSEN, HANS, BOUCHOMS, IGOR, PETRUS, MARIA, BRULS, RICHARD, JOSEPH, ZOLDESI, CARMEN, JULIA, DE JONG, ANTHONIUS, MARTINUS, CORNELIS, PETRUS, VAN DEN BOGAARD, FREDERIK, JOHANNES, LEENDERS, MARTINUS, HENDRIKUS, ANTONIUS, WANTEN, PETER, FRANCISCUS, VAN DER HEIJDEN, MARCUS, THEODOOR, WILHELMUS, GROENEWOLD, JAN
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:Substrates and Methods of Using Those Substrates A method of removing contamination from an apparatus used in lithography is disclosed. The method includes loading a substrate into the apparatus, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support layer, bringing the deformable layer of the substrate into contact with a surface of the apparatus from which contamination is to be removed, introducing relative movement between the deformable layer and the surface of the apparatus from which contamination is to be removed to dislodge contamination from the surface for removal, and removing the dislodged contamination. Other aspects of the invention are also described and claimed.