SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES

SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES

SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an ope...

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Bibliographische Detailangaben
Hauptverfasser: PENG NEO CHEE, SUKAMI JAMILON BIN, HAK ALEX TEO HONG
Format: Patent
Sprache:eng
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Zusammenfassung:SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.