METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT

METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT

METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUI CHRISTINA CHUNG MAN, FEIGENBAUM HAIM, WANG ZHIPING, MENG TAN YEOW, SCHREIBER CHRIS M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.