INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF

INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF

INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a de...

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Bibliographische Detailangaben
Hauptverfasser: YEE, PAK HONG, TAY, WUU YEAN
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Zusammenfassung:INTEGRATED CIRCUIT (IC) TEST ASSEMBLY INCLUDING PHASE CHANGE MATERIAL FOR STABILIZING TEMPERATURE DURING STRESS TESTING OF INTEGRATED CIRCUITS AND METHOD THEREOF A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.