COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS

COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS

COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and t...

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Hauptverfasser: HETZEL WOLFGANG JOHANNES, SIAT JIMMY, TENG ENG KIAN, CHUAN KOH YONG, AMMER FLORAIN, REISS WERNER JOSEF
Format: Patent
Sprache:eng
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Zusammenfassung:COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the the first substrate and the first semiconductor chip.