COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION OF COPPER

COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION OF COPPER A composition and associated method for chemical mechanical planarization of a copper-containing substrate are described and which afford low defectivity levels on copper during copper CMP processing. The composition comprises a colloidal...

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Hauptverfasser: SIDDIQUI JUNAID AHMED, USMANI SAIFI, MCCONNELL RACHEL DIANNE
Format: Patent
Sprache:eng
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Zusammenfassung:COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION OF COPPER A composition and associated method for chemical mechanical planarization of a copper-containing substrate are described and which afford low defectivity levels on copper during copper CMP processing. The composition comprises a colloidal silica that is substantially free of soluble polymeric silicates.