PROCESS SOLUTIONS CONTAINING SURFACTANTS

PROCESS SOLUTIONS CONTAINING SURFACTANTS Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width...

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Bibliographische Detailangaben
Hauptverfasser: ZHANG PENG, CURZI DANIELLE MEGAN KING, EUGENE JOSEPH KARWACKI,JR, BARBER LESLIE COX
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROCESS SOLUTIONS CONTAINING SURFACTANTS Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain embodiments, the process solution may reduce post-development defects such as pattern collapse or line width roughness when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of defects such as pattern collapse and/or line width roughness on a plurality of photoresist coated substrates employing the process solution of the present invention.