CAVITY CHIP PACKAGE

CAVITY CHIP PACKAGE

A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAN HIEN BOON, IKSAN HENRY, SUN YI SHENG ANTHONY, TANARY SUSANTO, KIM SEONG KWANG BRANDON
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.