LOW DIELECTRIC MATERIALS AND METHODS FOR MAKING SAME

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. These materials are characterized as having a dielectric constant (K) a dielectric constant of about 3.7 or...

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Bibliographische Detailangaben
Hauptverfasser: WEIGEL SCOTT JEFFREY, MACDOUGALL JAMES EDWARD, PETERSON BRIAN KEITH, KIRNER JOHN FRANCIS, DEIS THOMAS ALAN
Format: Patent
Sprache:eng
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