Flip chip bonding method for enhancing the performance of connection in flip chip packaging process and layered metal architecture of substrate for stud bump

A flip chip bonding method for enhancing a bonding performance between a chip (11) and a substrate (21) by forming a bump (13) on the chip (11) or the substrate (21), and a layered architecture of the substrate (21) for the same are disclosed. The flip chip bonding method comprises the steps of performing pre-treatment of a wafer (10) having chips, dicing it, and obtaining the pre- treated individual chip (11); performing pre-treatment of a substrate (21); aligning the pads (12) of the pre-treated chip (11) with the pads of the pre- treated substrate (22), and bonding the chip (11) and the substrate (21) together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure; and performing post-treatment for filling or molding resin after bonding. The chip (11) or the substrate (21) is formed with a plated bump, a stud bump (13) or a wedge bump, respectively. Here, the stud bump (13) or the wedge bump can be additionally formed on the plated bump. The bump can be made of Au, Ni, Ag or Cu. The bump of the substrate has the same size as the bump of the chip or any one of the bump of the substrate and the bump of the chip has a larger size than the other of them. The substrate is plated with Au, Ag, Cu, or Sn.