Mold die and method for manufacturing semiconductor device using the same

A mold die comprising a first die (7) having a recess (7A) and a second flat die (8). The first die (7) is disposed on a front surface of a wiring board (101) which has a plurality of openings (4) and bears a semiconductor chip (3) via an elastic material. The second die (8) is disposed on a back su...

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO AKIHIRO, SHIMAZAKI YOSUKE, KOMIYA KAZUMOTO, SHIBATA AKIJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A mold die comprising a first die (7) having a recess (7A) and a second flat die (8). The first die (7) is disposed on a front surface of a wiring board (101) which has a plurality of openings (4) and bears a semiconductor chip (3) via an elastic material. The second die (8) is disposed on a back surface of the wiring board (101) and includes a protrusion (8B) around the opening (4) in the wiring board. The protrusion seals the opening of the wiring board to prevent leakage of an insulating resin which seals the semiconductor chip and the openings in the wiring board.