POLISHING COMPOSITION

Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltrimethylammonium salt (BTMAC), and a water-soluble polymer (PVP-...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	YAMASAKI, Tomoki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltrimethylammonium salt (BTMAC), and a water-soluble polymer (PVP-PVA) containing nitrogen.