POLISHING COMPOSITION

Provided is a polishing composition capable of reducing device vibrations. This polishing composition comprises colloidal silica, a water-soluble polymer, a basic compound, water, and a vibration suppression agent which is a polymer having an ethylene oxide group and a weight average molecular weigh...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMASAKI, Tomoki, MAKINO, Hiroshi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a polishing composition capable of reducing device vibrations. This polishing composition comprises colloidal silica, a water-soluble polymer, a basic compound, water, and a vibration suppression agent which is a polymer having an ethylene oxide group and a weight average molecular weight of 1,500 to 30,000. The molar concentration of the vibration suppression agent is 6.9 × 10-10 mol/g or higher. The product of the mass concentration of the vibration suppression agent and the weight average molecular weight of the ethylene oxide group portion per molecule of the vibration suppression agent is 8.0 × 10-2 or greater. In the vibration suppression agent, the proportion occupied by the ethylene oxide group within alkylene oxide groups is 80% or greater in terms of weight average molecular weight.