WAFER ALIGNMENT METHOD AND SYSTEM

Wafers are aligned with one another by reference to features formed on or in each wafer. A method includes forming a first pivot-notch, a first stop-notch, and a first bias-notch in a first wafer by reference to first features formed on or in the first wafer. Also formed is a second pivot-notch, a second stop-notch, and a second bias-notch in a second wafer by reference to second features formed on or in the second wafer. A first wafer is mounted in an aligning device, wherein a two-contact element enters into the first pivot-notch, and a single-contact element enters the first stop-notch. The second wafer is mounted in the aligning device, wherein the two-contact element enters into the second pivot-notch, and the single-contact element enters the second stop-notch. A biasing force is exerted onto surfaces of the first and second bias-notches to align the first features with the second features.