SEALING RESIN SHEET FOR SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN AND METHOD FOR MANUFACTURING SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN

The present invention provides a sealing resin sheet for a substrate having an electronic component built therein, in which the linear expansion coefficient can be easily controlled and that can suppress the occurrence of a void during manufacturing. The present invention relates to a sealing resin...

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Bibliographische Detailangaben
Hauptverfasser:	SHIGA, Goji, IINO, Chie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a sealing resin sheet for a substrate having an electronic component built therein, in which the linear expansion coefficient can be easily controlled and that can suppress the occurrence of a void during manufacturing. The present invention relates to a sealing resin sheet for a substrate having an electronic component built therein, the sealing resin sheet having a single layer structure with a thickness of 150-1000 μm inclusive and having a linear expansion coefficient of 10-28 ppm/K, inclusive, after being heat-treated for one hour at 150 °C. It is preferable that the sealing resin sheet for a substrate having an electronic component built therein contain an inorganic filler with an average particle diameter of 0.5-5 μm and that the content of the inorganic filler be 70-87 weight%.