MODULAR SYSTEM FOR MOULDING ELECTRONIC COMPONENTS AND KIT-OF-PARTS FOR ASSEMBLING SUCH A MODULAR SYSTEM

MODULAR SYSTEM FOR MOULDING ELECTRONIC COMPONENTS AND KIT-OF-PARTS FOR ASSEMBLING SUCH A MODULAR SYSTEM

The invention relates to a modular system for moulding electronic components, comprising at least three separate system modules; a press module for moulding the electronic components; a loader module for loading the electronic components to be moulded from a cassette to a press module; and a service...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VENROOIJ, Johannes, Lambertus, Gerardus, Maria, KLEIJBURG, Jeroen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a modular system for moulding electronic components, comprising at least three separate system modules; a press module for moulding the electronic components; a loader module for loading the electronic components to be moulded from a cassette to a press module; and a service module configured to at least partially control each of the other system modules. The invention also relates to a kit-of-parts for assembling such a modular system.