FILM FOR FORMING PROTECTION FILM

This film for forming a protection film is provided for the purpose of forming a protection film for protecting a semiconductor chip, and the surface of the film after curing has a shore D hardness equal to or higher than 55, and a Young's modulus (23°C) equal to higher than 1.0×109 Pa.

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Bibliographische Detailangaben
Hauptverfasser:	INAO, Youichi, SAIKI, Naoya
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	This film for forming a protection film is provided for the purpose of forming a protection film for protecting a semiconductor chip, and the surface of the film after curing has a shore D hardness equal to or higher than 55, and a Young's modulus (23°C) equal to higher than 1.0×109 Pa.