METHOD FOR ELECTROMAGNETIC SHIELDING AND THERMAL MANAGEMENT OF ACTIVE COMPONENTS

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MUKAI, Kenichiroh, MAGAYA, Tafadzwa, KIM, Kwonil, BRANDT, Lutz, GAHERTY, Lee
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.