RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE PACKAGE

Provided is a resin sheet in which the sheet thickness is large and the amount of outgas is reduced. The present invention pertains to a resin sheet for electronic device sealing in which the thickness thereof is 100-2000 μm and the amount of gas generated when cured for one hour at 150°C is no more...

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Bibliographische Detailangaben
Hauptverfasser:	TOYODA, EIJI, SHIMIZU, YUSAKU, ISHIZAKA, TSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin sheet in which the sheet thickness is large and the amount of outgas is reduced. The present invention pertains to a resin sheet for electronic device sealing in which the thickness thereof is 100-2000 μm and the amount of gas generated when cured for one hour at 150°C is no more than 500 ppm.