RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME

The present invention provides a resin composition for encapsulating electronic elements that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; a resin composition for encapsulating electronic comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TABEI, JUN-ICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a resin composition for encapsulating electronic elements that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; a resin composition for encapsulating electronic components that contains an epoxy resin and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; and a resin composition for encapsulating electronic components that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C., in which a glass transition temperature (Tg) of a cured material of the encapsulating resin composition is equal to or higher than 200° C., and when the cured material is heated for 1,000 hours at 200° C. in the atmosphere, a weight reduction rate of the cured material becomes equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.