MULTIPLE-HEAD WIRE-BONDING SYSTEM

The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-he...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KWAN KA SHING, KENNY, CHAN TIN KWAN, BOBBY, SONG KENG YEW, JAMES, WONG YAM MO, NG HON YU, PETER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.