PROCESSES AND APPARATUS FOR RECOVERY AND REMOVAL OF COPPER FROM FLUIDS

The invention provides novel processes and apparatus for removal of copper from a solution or fluid, particularly spent etchant solutions that contain copper produced through printed circuit board manufacture. The invention is particularly useful for recovery/removal of copper from aqueous admixture...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MARTIN T. GOOSEY
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PRETREATMENT OF RAW MATERIALS PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS PRODUCTION AND REFINING OF METALS SEPARATION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Beschreibung
Zusammenfassung:	The invention provides novel processes and apparatus for removal of copper from a solution or fluid, particularly spent etchant solutions that contain copper produced through printed circuit board manufacture. The invention is particularly useful for recovery/removal of copper from aqueous admixtures that contain a copper complexing agent,