PROCESSING APPARATUS AND METHOD OF PROCESSING WAFER

Disclosed is a technology which enables dicing of a wafer without removing the wafer from a holding table in the wafer of which a circular concave portion and an outer periphery convex portion are formed on a back surface. To this end, the present invention relates to a device for processing the wafer, which comprises: a rotatable holding table having a holding portion made of a transparent material, and holding a surface side of the wafer; a lower imaging camera for photographing the surface of the wafer held by the holding table through the holding portion; a first cutting unit having a first cutting blade for cutting the outer periphery convex portion of the back surface of the wafer to reduce a height of the outer periphery convex portion; and a second cutting unit having a second cutting blade for cutting the wafer along a street of the surface of the wafer photographed by the lower imaging camera.