VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises...

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Bibliographische Detailangaben
Hauptverfasser: LU, JIONGXIN, COMBS, CHRISTOPHER, ZHANG, JIEPING, DEPPISCH, CARL, RARAVIKAR, NACHIKET R, KLEIN, STEVEN A, HUETTIS, ALEXANDER, HARPER, JOHN, MALATKAR, PRAMOD, SOOD, MOHIT, LU, XIAO
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.