EDGE TRIMMING APPARATUS

An edge trimming apparatus includes a chuck table that causes a ring-shaped groove with an outer diameter smaller than the outer diameter of a wafer to communicate with a suction source to hold under suction a lower surface of the wafer by the ring-shaped groove, a cutting unit that rotates a cutting blade and annularly cuts a circumferential part of the wafer held by the chuck table, and a cleaning unit that cleans a region outside the ring-shaped groove in the upper surface of the table and the upper surface of the table including the ring-shaped groove. The cleaning unit is positioned to the region outside the ring-shaped groove in the upper surface of the table and the upper surface of the chuck table including the ring-shaped groove, and the chuck table is rotated to clean the ring-shaped groove and the upper surface.