FOD adhesive film and semiconductor package including the same
To provide an FOD adhesive film that solves a technical problem of the prior art, and a semiconductor package including the same.SOLUTION: An FOD adhesive film according to the present invention may include an adhesive layer and a laminated structure in which a support layer is laminated on one surf...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | To provide an FOD adhesive film that solves a technical problem of the prior art, and a semiconductor package including the same.SOLUTION: An FOD adhesive film according to the present invention may include an adhesive layer and a laminated structure in which a support layer is laminated on one surface of the adhesive layer.SELECTED DRAWING: Figure 4 |
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