SEALING COMPOSITION AND SEMICONDUCTOR DEVICE

A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by...

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Bibliographische Detailangaben
Hauptverfasser:	HORI, Keichi, KANG, Dongchul, SEKIGUCHI, Kazuhide, NAMAI, Naoki, HORIE, Takahiro, ISHIBASHI, Kenta
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg 1-x Al x (OH) 2 (CO 3 ) x/2 ¢mH 2 O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.