PHOTORESIST STRIPPER

OF THE DISCLOSURE PHOTORESIST STRIPPER Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy- based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether...

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Bibliographische Detailangaben
Hauptverfasser: Yuanmei CAO, Richard Dalton Peters
Format: Patent
Sprache:eng
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Zusammenfassung:OF THE DISCLOSURE PHOTORESIST STRIPPER Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy- based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether solvent, potassium hydroxide, and an amine. The solutions also exhibit reduced potassium carbonate crystal formation compared to conventional formulations containing potassium hydroxide, and extended bath life compared to 10 formulations containing tetramethylammonium hydroxide. [no figure] -34-