METHOD OF PROCESSING WORKPIECE

METHOD OF PROCESSING WORKPIECE Disclosed herein is a method of processing a workpiece having a plurality of streets provided on a face side thereof, the method including: a laser beam applying step of applying a laser beam having a wavelength that is transmittable through the workpiece along the str...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Yoshiaki Yodo
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:METHOD OF PROCESSING WORKPIECE Disclosed herein is a method of processing a workpiece having a plurality of streets provided on a face side thereof, the method including: a laser beam applying step of applying a laser beam having a wavelength that is transmittable through the workpiece along the streets while focusing the laser beam at a point within the workpiece, thereby forming modified layers in the workpiece along the streets and cracks extending from the modified layers to the face side; and a cutting step of, thereafter, cutting the workpiece from a reverse side thereof along the streets while supplying the workpiece with a cutting fluid, thereby removing the modified layers from the workpiece. (Figure 4)