METHOD AND SYSTEM FOR PACKAGE INSPECTION

METHOD AND SYSTEM FOR PACKAGE INSPECTION An inspection system for inspecting a semiconductor package, the system comprising: an inspection device having a vertically aligned imaging device and at least one pair of imaging devices in relative orthogonal orientation; said vertically aligned and at least one pair of orthogonally positioned imaging devices directed towards an inspection zone, said inspection zone arranged to receive said semiconductor package, and; a control system arranged to receive 2 dimensional images from the vertically aligned and orthogonally oriented pair of imaging devices; wherein the control system is arranged to create a 3 dimensional image from the 2 dimensional images captured by the orthogonal imaging devices, and further arranged to inspect the semiconductor package based upon the created 3 dimensional image and captured 2 dimensional images. Figure 4