BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND DIE STRUCTURE

BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND DIE STRUCTURE

A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer...

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Hauptverfasser: POIH CHANG, KUAN-WEI CHEN, CHIENOU CHEN, PEI-JER TZENG
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Sprache:eng
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creator POIH CHANG
KUAN-WEI CHEN
CHIENOU CHEN
PEI-JER TZENG
description A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.
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title BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND DIE STRUCTURE
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