BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND DIE STRUCTURE
A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer. |
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