PRE-APPLIED UNDERFILL

PRE-APPLIED UNDERFILL

Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-...

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Bibliographische Detailangaben
Hauptverfasser: MICHAEL K. GALLAGHER, JEFFREY M. CALVERT, AVIN V. DHOBLE, EDGARDO ANZURES, CHI Q. TRUONG, DAVID FLEMING, ANUPAM CHOUBEY
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.