Device for controlled feed of adhesive onto surface of circuit board incorporates sprung dispensing unit with corresponding mouthpiece on which distance component is fixed, which incorporates fixture arrangement and support components

The device for the controlled feed of adhesive onto the surface of a circuit board incorporates a sprung dispensing unit (1) with a corresponding mouthpiece (3), on which a distance component (4) is fixed. The distance component incorporates a fixture arrangement (5) and a number of support components (6). In the method used, the distance component is fixed to the dispensing mouthpiece and the arrangement is placed in a predetermined dispensing position. The arrangement is then firstly moved so that the support components come into contact with a circuit board surface. The adhesive is then dispensed and the arrangement is moved away from the surface.