FORFARANDE OCH ANORDNING FOR BESTEMNING AV STRUKTURBILDNINGSKINETIKEN OCH ADHESIONSEGENSKAPERNA HOS BINDEMEDEL

A method for monitoring structural changes in a binder in contact with a solid object, while the binder is curing. Conductivity measuring pick-ups are placed in the binder mass and at the boundary between the binder and the solid object. A low amplitude AC voltage is applied to each pick-up at a low...

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Bibliographische Detailangaben
Hauptverfasser: 1)I L EBERLING, 5)V I KOVALENKO, 8)M Y TITOV, 4)A M YAKOVLEV, 2)L A TERESCHENKO, 3)N I NIKOLAEV, 7)R A TATEVOSIAN, 6)N K LIPATOV
Format: Patent
Sprache:swe
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Beschreibung
Zusammenfassung:A method for monitoring structural changes in a binder in contact with a solid object, while the binder is curing. Conductivity measuring pick-ups are placed in the binder mass and at the boundary between the binder and the solid object. A low amplitude AC voltage is applied to each pick-up at a low frequency, and the pick-up output signals are compared by a differential inductive bridge. The difference between the output signals is indicative of the extent of adhesion of the binder to the solid object. Preferably, only those components of the pick-up signals which are in phase with the applied AC voltage are employed for the comparison.