Procedure and device for producing microwire

The invention is a roller and drawing technique, particularly a procedure and device for producing microwire. The procedure is unique in that when the microwire (1) material (1) is drawn, it is made to roll alternately in relation to a drawing shaft (B-B) an equal distance constituting at least half...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	4)S A BARTASHEVICH, 5)V S KARPITSKY, 2)V G VOITOV, 3)S S KLIMENKOV, 1)A V STEPANENKO
Format:	Patent
Sprache:	eng ; swe
Schlagworte:	AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention is a roller and drawing technique, particularly a procedure and device for producing microwire. The procedure is unique in that when the microwire (1) material (1) is drawn, it is made to roll alternately in relation to a drawing shaft (B-B) an equal distance constituting at least half of the periphery length of the material (1). A device for executing the procedure comprises a housing (3), a die (4) and a mechanism for drawing the microwire through the die (4). The die (4) is made of two components (5 and 6) that are arranged to work together with the microwire material (1), which is drawn through the components (5 and 6) during the drawing procedure. Each of the components has a calibration surface (8). The die (4) components (5 and 6) of the invention are fastened in the housing (3) in such a way that they can move forward and rearward synchronously with one another in a mutually parallel plane. The calibration surfaces (8) of both components (5 and 6) are flat and parallel with one another and with the die (B-B).The invention's procedure and device for producing microwire can be used to produce semiconductor devices and integrated microcircuits as well as for the improvement of the surface quality of microwire produced using other known procedures and devices.