SE371559
A base plate for semiconductor component housings. The base plate is characterized in that only the portion of the base plate, to which the semiconductor is soldered, is nickel plated while the remainder is copper plated.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A base plate for semiconductor component housings. The base plate is characterized in that only the portion of the base plate, to which the semiconductor is soldered, is nickel plated while the remainder is copper plated. |
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