A multi-layer waveguide arrangement

The present disclosure relates to a waveguide arrangement comprising a first outer layer (109) and at least two intermediate layers (111a, 111b, 111c) comprising a first intermediate layer (111a) and a third intermediate layer (111c). The first intermediate layer (111a) is bonded to the third intermediate layer (111c) and the first outer layer 109 is bonded to the first intermediate layer (111a). At least one first probe part (114a, 114'a) is formed in the first intermediate layer (111a), at least one respective probe post (113, 113') connected to the first probe part (114a, 114'a) is formed in the third intermediate layer (111c), and at least one second probe part (114b, 114'b) is formed in the first outer layer (109). Each second probe part (114b, 114'b) protrudes via a respective probe aperture (115, 115') and constitutes a continuation of the respective first probe part (114a, 114 'a). The layers are at least partly metallized, where a first waveguide conductor part (102) is formed in the first intermediate layer (111a) and a third waveguide conductor part (104) is formed in the third intermediate layer (111c).